Powering the Next Decade of Industrial Electrification
As global industries accelerate toward electrification, energy efficiency, and net-zero targets, power semiconductors are emerging as the silent enablers of this transformation.
In this interview, Harshad Mehta, Founder of RIR Power, shares his technical perspective on how wide-bandgap technologies such as Silicon Carbide (SiC) and Gallium Nitride (GaN) are reshaping high-voltage power conversion across rail, renewable energy, EV charging, and industrial automation.
From the evolution of ultra-high-voltage devices and advanced thermal management to the growing role of AI, digital monitoring, and cybersecurity in power electronics, the conversation explores the critical design challenges and breakthroughs that will define reliable, high-efficiency power systems over the next decade.
What are the most significant advancements in power semiconductor technologies, such as SiC and GaN devices, that you foresee impacting energy efficiency and high-voltage applications in the global industrial sector over the next decade?
Over the next decade, wide-bandgap semiconductors—particularly Silicon Carbide (SiC)—will fundamentally redefine high-voltage and high-power applications. Advancements in high-voltage SiC devices beyond 10 kV, including next-generation SiC IGBTs, MOSFETs, and diodes, will enable higher switching frequencies, lower conduction losses, and dramatically improved system efficiency. This will directly impact grid infrastructure, rail traction, renewable integration, and hydrogen electrolyzers. While GaN will dominate lower-voltage, high-frequency applications, SiC will be the technology of choice for medium- and high-voltage industrial systems where efficiency, power density, and reliability are critical.
How do you anticipate the integration of wide-bandgap semiconductors will transform traditional power conversion systems in emerging markets, and what technical challenges must be addressed to ensure reliable deployment?
Wide-bandgap semiconductors will allow emerging markets to leapfrog legacy power conversion architectures. SiC-based systems enable smaller, lighter, and more efficient converters, reducing balance-of-system costs and improving reliability in challenging grid environments. However, reliable deployment requires addressing key technical challenges such as high-voltage gate drive design, electromagnetic interference (EMI), insulation coordination, and long-term device reliability under harsh operating conditions. Developing robust packaging, thermal management, and qualification standards will be essential for large-scale adoption.
In the realm of electrification, what key obstacles do you see in developing robust power electronics for electric vehicle charging infrastructure, and how might innovations in thermal management and switching efficiency mitigate these?
The primary obstacles in EV charging infrastructure are efficiency losses, thermal stress, grid compatibility, and reliability under continuous high-power operation. Ultra-fast chargers operating at hundreds of kilowatts demand power devices that can handle high voltages and currents with minimal losses. Innovations in high-efficiency SiC switching devices, advanced module packaging, and double-sided cooling technologies significantly reduce thermal bottlenecks. These advances enable higher power density, longer operating life, and lower total cost of ownership for charging networks.
How has the adoption of digital technologies, including AI and IoT, influenced the design and reliability of power modules and IGBTs in industrial applications, and what technical best practices are crucial for optimization?
Digital technologies such as AI and IoT have transformed power electronics from passive components into intelligent systems. Embedded sensing, real-time monitoring, and predictive analytics now enable condition-based maintenance and early fault detection in power modules and IGBTs. Best practices include integrating temperature, voltage, and current sensing at the module level, using digital twins for design validation, and leveraging AI-driven models to optimize switching behavior and lifetime performance. This convergence significantly enhances reliability, uptime, and system efficiency.
What role does cybersecurity play in safeguarding power electronic systems within critical infrastructure, and what emerging vulnerabilities should the industry prioritize in its technical development strategies?
As power electronic systems become increasingly connected, cybersecurity has emerged as a critical design consideration—particularly for grid, transportation, and industrial infrastructure. Vulnerabilities can arise at control interfaces, firmware layers, and communication protocols. Secure-by-design architectures, hardware-based authentication, encrypted communications, and robust firmware update mechanisms are essential to prevent vulnerabilities that could impact system availability and safety. Ensuring cybersecurity resilience is now as important as electrical and thermal robustness in critical power systems.
From a technical perspective, how can advancements in thyristors and diodes contribute to achieving sustainability targets in sectors like renewable energy and industrial automation?
Despite the rise of wide-bandgap devices, advanced thyristors and high-efficiency diodes remain indispensable for high-power, high-current applications such as HVDC transmission, industrial drives, and renewable energy systems. Improvements in wafer design, lifetime control, and thermal performance reduce losses and improve system efficiency at scale. These devices enable efficient bulk power transfer and conversion, directly supporting sustainability targets by minimizing energy losses across large industrial and grid installations.
What are the main supply chain challenges facing the power electronics industry globally, and how could localized manufacturing strategies in regions like Asia enhance technical resilience and innovation?
The power electronics industry faces significant supply chain challenges, including geopolitical risk, long qualification cycles, and dependence on a limited number of fabrication hubs. Localized manufacturing strategies can enhance technical resilience by shortening supply chains, improving process control, and enabling faster innovation cycles. Establishing domestic capabilities for design, fabrication, packaging, and testing is critical not only for supply security but also for developing region-specific solutions optimized for local applications.
How will evolving international standards and regulations on energy efficiency affect the adoption of advanced power semiconductors, and what technical interoperability considerations should be emphasized?
Stricter global energy efficiency standards and carbon reduction regulations will accelerate the adoption of advanced power semiconductors. These regulations increasingly favor high-efficiency, low-loss solutions such as SiC-based systems. From a technical standpoint, interoperability, standardization of module footprints, qualification protocols, and compliance with international safety and reliability standards will be essential to ensure seamless global deployment and scalability.
What opportunities exist for collaboration between power electronics manufacturers and sectors like automotive and renewable energy to advance innovations in integrated power management systems?
There are significant opportunities for deep collaboration between power semiconductor manufacturers and sectors such as automotive and renewable energy. Co-development of integrated power modules, optimized for specific system architectures, can dramatically improve performance and reduce system costs. Joint innovation in areas like traction inverters, onboard chargers, wind and solar inverters, and energy storage interfaces will be key to advancing integrated power management solutions.
Looking forward, what technical breakthroughs in high-power semiconductor devices do you predict will drive the acceleration towards net-zero goals in energy-intensive industries?
Looking ahead, breakthroughs in ultra-high-voltage SiC devices, advanced power module packaging, and integrated power systems will be decisive in accelerating net-zero goals. Devices operating at 10 kV and beyond will enable more efficient electrification of power grids, heavy industry, rail, mining, and hydrogen production. Combined with digital control, advanced thermal management, and system-level optimization, these innovations will significantly reduce energy losses and carbon intensity across energy-intensive sectors.
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